1·Its accuracy will influence the accuracy of LED die bonder.
其精度直接影响到LED粘片的精度。
2·Die Bonder is manufacturing equipment which binds IC chip onto Lead Frame in semiconductor production.
机是用于将IC芯片粘结到引线框架的半导体器件生产专用装备。
3·IC Die Bonder is key equipment which binds semiconductor microchip onto Lead Frame in semiconductor back-end production.
集成电路粘片机是将半导体晶圆上微芯片贴装到引线基架的半导体制造后工序关键性生产设备。
4·The auto Die Bonder for SOT - 23 transistor is a high - speed, high - precision, machinery electronics integrated equipment.
23晶体管封装自动键合机是高速、高精度机电一体化精密设备。
5·The image recognition system is the key component of realizing the automation of LED die bonder as well as its difficult part.
图像识别系统是实现LED粘片自动化的关键部分，也是其难点。
6·This paper introduces the original struchure and principle of the bondhead device for high speed die bonder designed by author.
本文介绍作者设计的高速芯片焊接机焊头的独特结构和工作原理，并给出了主要设计参数和计算公式。
7·The experimental results indicate that the designed parallel mechanism can meet the working requirements of the IC die bonder and each performance index has reached the design standards.
实验结果表明：所设计的机构能满足IC芯片粘片机的工作要求，各项性能指标均达到了设计标准。
8·An experimental platform of the IC die bonder has been manufactured, and parameters such as moving precision and position accuracy have been measured by using image recognition technology.
设计制造出IC芯片粘片机焊头机构的实验平台，采用图像处理的方式来测量焊头的运动精度和定位精度等参数。
9·Mainly introduce the function of the eutectic bonder applied to high power die, the technology target, the structure of the machine and the electric control.
本文主要介绍了大功率管芯共晶设备的主要功能、技术指标、机械结构、电气控制等。